Global Electronics Association Expands Malaysia Presence to Advance Semiconductor Ecosystem

Office Visit with Minister of Economy

Global Electronics Association expanded its Malaysia presence in Penang, strengthening semiconductor collaboration, workforce development, standards adoption, advanced packaging initiatives, and regional supply chain resilience through strategic partnerships.

Global Electronics Association Strengthens Collaboration

The Global Electronics Association has strengthened its commitment to Malaysia’s electronics and semiconductor industry by expanding its presence in Penang, reinforcing the country’s role as a key hub for regional supply chain development and advanced manufacturing.

Located in Bayan Lepas within the National Technology and Innovation Centre (NTIC), the Association’s Malaysia office serves as a regional hub supporting collaboration, workforce development, standards adoption, and supply chain resilience across Malaysia and Southeast Asia. Operational since January 2026, the office has become a focal point for industry engagement and technical capability building.

Its growing role was highlighted during visits by Malaysia’s Minister of Economy, YB Tuan Haji Akmal Nasrullah Bin Haji Mohd Nasir, and Penang Chief Minister YAB Tuan Chow Kon Yeow during the NTIC inauguration in June. The engagements underscored cooperation between government and industry to strengthen Malaysia’s electronics manufacturing ecosystem.

By June 2026, the Association had delivered more than 200 technical training programmes and classroom sessions covering PCB assembly, semiconductor processes, electronics manufacturing, quality control, smart factory practices, and wire harness technologies across several Malaysian states.

The Association has also launched Malaysia’s first Standards Development Committee, bringing together industry players to develop locally relevant standards while aligning with global best practices. It is also supporting the Malaysia Advanced Packaging Consortium following the Advanced Electronic Packaging Consortium Workshop, which gathered over 200 industry leaders, multinational companies, government representatives, and academics.

Looking ahead, the Association will continue strengthening regional connectivity through Integrated Electronics Manufacturing & Interconnections (IEMI) Malaysia 2027, helping Malaysian companies expand participation in global electronics supply chains while promoting innovation, resilience, and long-term industry competitiveness.